IC CARD PRINTED BOARD AND IC MODULE FOR IC CARD

摘要

PROBLEM TO BE SOLVED: To simplify a manufacturing process and reduce a manufacturing cost by treating gold plating of both sides of a printed board which mounts an IC chip by hard gold plating alone by adopting a face-down method in an IC card printed board. SOLUTION: An external connection terminal 13a and a wiring pattern layer 16a consisting of a copper foil are formed in a printed board 11 by etching the printed board 11. The external connection terminal 13a in a front and the wiring pattern 16a in a rear are connected electrically by a through-hole 15. The etched printed board 11 is cleaned with water and immersed in acid. Thereafter, nickel foundation plating is applied. Then, metallic acid of nickel and cobalt is added to gold plating solution for carrying out 2.5μm thick hard gold plating and hard gold plating layers 13c, 16c are formed. Thereby, simple manufacturing is realized and a cost is reduced.