| 摘要 |
PROBLEM TO BE SOLVED: To shorten a manufacturing process and to enhance drill workability and productivity by applying, drying, and semi-setting an adhesive agent containing a specific component to the circuit surface of a rigid circuit board, and uniting it with a flexible circuit board with a cover lay into a body by applying heat and pressure. SOLUTION: On a flexible circuit board with a cover lay wherein a circuit- formed polyimide cover lay film is laminated, a rigid circuit board with an adhesive agent obtained by applying, drying, and semi-setting an adhesive agent on the circuit surface of a rigid circuit board having a circuit formed on the adhesion surface to the flexible circuit board with a cover lay is arranged. After they are united into a body by applying heat and pressure to form a multilayer flex rigid laminated board, it is after-processed. An adhesive agent to be used at this time contains epoxy resin, novolak-type phenol resin, and an imidazole derivative as essential components. Besides, the flow of the adhesive agent on the rigid circuit board with an adhesive agent, on the occasion of applying heat and pressure on conditions of 160 deg.C, 40kgf/cm<2> is 0.5mm or less. |
