| 摘要 |
PROBLEM TO BE SOLVED: To provide a conductive composition that has high deflection adhesive strength and a good solder wettability by using binder components, consisting of a resol type phenol resin and an alkoxyalkyl compound, and metal particles of specific sizes as its main components. SOLUTION: A polymer type conductive composition of high reliability which is wetted with solder in a wide temperature range is obtained whose main components are 3 to 40wt.% binder components, consisting of a resol type phenol resin having a dimethylene-ether bond and an alkoxyalkyl compound, and 60 to 97% metal particles with an average grain size of 0.1 to 50μm. The alkoxyalkyl compound is a compound represented by formula 1 or 2 wherein (p) and (q) are 1 to 3, R is an alkyl group, R' is an alkyl group, an alkoxy group, a carboxylate group, a sulfonate group, or a phosphate group, R''' is an ethylene group, and X is Si, Ti, Al, or Zr, and is preferably 0.5 to 10% of the binder components. The binder components preferably contain 0.5 to 30% linear macromolecular resin.
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