| 摘要 |
<p>PROBLEM TO BE SOLVED: To realize a highly dense and low profile structure by providing an inner lead tip and one of electrode terminals for connecting a bus bar on a chip in a space part between the inner lead and bus bar and further providing a wiring by a bonding wire. SOLUTION: An inner lead 6, a bus bar 5 and electrode terminals 7 and 8 of a semiconductor chip are connected with each other through a wire 4. The inner lead 6 and bus bar 5 are positioned opposite to each other viewed from the terminals 7 and 8, so no short-circuit occurs therebetween and the terminals 7 and 8 can be connected with each other through a low loop. For example, an insulation member 2 coated with adhesives is bonded with the bus bar 5 and inner lead 6 from a semiconductor chip 3 side, and then the inner lead 6 and terminal 7 are connected with each other, further the bus bar 5 and terminals 8 are connected with each other, and they are filled with resin.</p> |
