| 摘要 |
PROBLEM TO BE SOLVED: To make a wiring pattern into higher density and to improve strength of a connection pad layer by forming at least one photo-via, connecting a connection pad with an inner layer pattern on a substrate, in the connection pad. SOLUTION: A connection pad 2 directly or indirectly connected to a connectiointerminal of a mother board, and an inner layer pattern 3 connected to the connection pad 2, are provided. In such a semiconductor package substrate 1, at least one photo-via 4, connecting the connection pad 2 with the inner layer pattern 3, is provided in the connection pad 2. For example, a single photo-via 4 is formed on the central position of an LGA pad 2, and the inner pattern 3 and the LGA pad 2 are connected to each other through the photo-via 4. The LGA pad 2 is formed into circle whose diameter A is 600μm, and the photo-via 4 is formed into circle whose diameter B is 150μm. |
