发明名称 MULTICHIP SEMICONDUCTOR STRUCTURE WITH INTEGRATED CIRCUIT AND ITS PREPARATION
摘要 PROBLEM TO BE SOLVED: To provide a multichip semiconductor structure having an integrated circuit and a programmable circuit which protects the input-output nodes of chips from static discharge by providing the chips of a first semiconductor device and a second semiconductor chip electrically and mechanically coupled with each other in the multichip semiconductor structure. SOLUTION: A multichip semiconductor structure is provided with a first semiconductor chip having a first circuit which gives a prescribed circuit function and a second semiconductor chip which is electrically and mechanically coupled with the semiconductor chip. The second semiconductor chip has a second circuit which partially gives a circuit function to the first circuits. That is, a memory array chip 10 is provided wit memory arrays 12 which are divided from each other by a word decoder 14 for a word line having a tap at the center. The bit switch, sense amplifier, and driver 16 of the memory array 12 are arranged along the edge section 18 of the chip 10. The circuit 14 and driver 16 are called 'memory access circuits'.
申请公布号 JPH0992781(A) 申请公布日期 1997.04.04
申请号 JP19960031735 申请日期 1996.02.20
申请人 INTERNATL BUSINESS MACH CORP <IBM> 发明人 SUCHIIBUN HAWAADO BUOORUDOMAN;POORU EBUANSU BEEKUMAN JIYUNIA
分类号 H01L25/00;G11C5/00;G11C11/401;H01L21/82;H01L21/822;H01L27/04;(IPC1-7):H01L25/00 主分类号 H01L25/00
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