LEAD FRAME AND ITS MANUFACTURE AND SEMICONDUCTOR ELEMENT PACKAGE USING IT

摘要

PROBLEM TO BE SOLVED: To provide such a lead frame coated with a thermo-plastic polyimide resin that can be thinly packaged and needs no expensive die for punching out a double-faced adhesive tape. SOLUTION: The part to be adhered to a semiconductor element in a lead frame 1 for A LOC package is coated with thermo-plastic polyimide resin 2 10μm and 50μm thick. Thus, no thick double-faced adhesive tape of three-layer structure is needed, resulting in a thin package, and no expensive die for punching out the double-faced adhesive tape accucrately is also needed, which causes no continuity failure due to punched burrs.