| 摘要 |
<p>PROBLEM TO BE SOLVED: To obtain a lead frame which is superior in flatness because of no bending or tilting, fixes a semiconductor chip thereon without peeling off, and is excellent in adhesion to packaging resin, and a semiconductor device which is superior in reliability and has a long service life. SOLUTION: A lead frame is provided with a pad 1 to be mounted with a semiconductor chip and an inner lead 6 connecting to an outer lead around the pad 1, and dimples are formed on the back surface of the pad 1 and a recessed part 3 which is shallower than the dimple is formed at a low density on the surface to be mounted with the semiconductor chip. Further, the semiconductor chip is fixed and mounted on the surface of the pad of the lead frame by using adhesives, and chip terminals and inner leads are connected with each other and are packaged with resin, thereby forming a semiconductor device.</p> |
