| 摘要 |
PROBLEM TO BE SOLVED: To prevent a solder from scattering in the die bonding step by providing a notch at such a position that it is positioned opposite to the main surface of a semiconductor element and making a through hole in the same manner as well. SOLUTION: A lead frame is provided with a die pad 1, a frame 5, leads 6, and connecting parts 4, and a plurality of die pads 1 are arranged in one direction between two frames 5. The lead 6 is arranged opposite to the die pad 1 and the die pad 1 and frame 5 are connected with each other through the connecting part 4. The die pad 1 connecting with the part 4 is provided with through holes 2 on both its sides, and the side opposite to the lead 6 is provided with a notch 3. A chip 7 is placed on the die pad 1 in such a manner that the through hole 2 and notch 3 are positioned under the chip 7, and the chip 7 is connected to the die pad 1 by soldering. Since a pressure is applied to the chip 7 to spread the solder at that time, the solder is allowed to flow toward the notch 3, so that it is prevented from scattering over the lead 6. |
