| 摘要 |
PROBLEM TO BE SOLVED: To suppress the crosstalk noise due to a parasitic current generated in a conductor circuit pattern layer while enhancing the thermal diffusion by composing the conductor circuit pattern, on the side a resin board opposite to the semiconductor mounting side, of a ground plane and an external connection terminal land. SOLUTION: The semiconductor device comprising a semiconductor chip mounting circuit board 20, i.e., a resin board 11, having first and second conductor circuit pattern sides 18, 19, a semiconductor chip 24, a bonding wire 26, a resin package 27, and solder balls 28. In such a semiconductor device, the second conductor circuit pattern 19 has a ground plane 29 conducting thermally and electrically with the semiconductor chip mounting stage 14 of first conductor circuit pattern sides 18 through a second via 12. A plurality of external connection terminal lands 30 conducting electrically with the conductor lead 17 of first conductor circuit pattern 18 through a first via 16 are provided on the same plane. |
