| 摘要 |
PROBLEM TO BE SOLVED: To prevent a coating film on the surface of a wafer from varying in thickness throughout the surface of the wafer in a thermal treatment and solvent comprised in a coating film vaporized through a thermal treatment from leaking out of a thermal treatment device. SOLUTION: A thermal treatment device 1 is composed of a hermetically closed chamber 12 where a wafer 40 on which a coating film is formed is housed, a heating means 13 which heats the inside of the hermetically closed chamber 12, a hood 14 which surrounds the hermetically closed chamber 12, and an exhausting means 15 which exhausts the inside of the hood 14. |
