| 摘要 |
PROBLEM TO BE SOLVED: To obtain a package in which a semiconductor element can be set, while being secured firmly, in a cavity without applying undue force, the number of machining steps of the cover is decreased, and stress due to repeated heating/ cooling the semiconductor element is relaxed at each joint of the ceramic board, the cover, and the semiconductor element. SOLUTION: A semiconductor element 14 is secured through a first solder 11 onto the upper surface of a ceramic board 16 and a cover 17 having a cavity 18 for containing the semiconductor element 14 is bonded to the upper surface of a ceramic board 16 at the circumferential fringe thereof so that the semiconductor element 14 is contained in the cavity. The cover 17 comprises a cover body 19 covering the upper surface of the semiconductor element 14, and a frame member 26 independent from the cover body 19 with the upper surface being bonded through a buffer material 24 to the lower surface of the cover body 19 at the circumferential fringe thereof. The cover body 19, the frame member 26 and the ceramic board 16 have coefficients of thermal expansionα1 ,α2 ,α3 satisfying a relationshipα1 <=α2 <=α3 .
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