ENCAPSULATION OF AN OPTOELECTRONIC SEMICONDUCTOR COMPONENT WITH AN OPTICAL ELEMENT AND METHOD OF PRODUCING THE SAME

摘要

The invention concerns an optoelectronic semiconductor component (1) comprising a chip carrier (3) which has an approximately flat surface (2) and on which an optoelectronic semiconductor chip (4) is secured with predetermined alignment of its optical axis (5). The component (1) further comprises a plastics material base part (6) which is associated with and supports the chip carrier (3). The semiconductor chip (4) is connected in an electrically conductive manner to at least two electrode connections (7, 8) passing through the base part (6), and a lens (10) engaging over the base part (6) is associated with the semiconductor chip (4). The lens (10) engaging over the base part (6) is part of an independent plastics material cap (11) comprising retaining means (13) for an interlocking mechanical connection to a support means (14) of the base part (6). When the cap (11) is placed on the base part (6), the retaining means (13) and support means (14) engage with each other. The retaining means (13) and support means (14) are designed such that, when the cap (11) is placed on the base part (6), they are automatically positioned relative to one another such that the optical axes (12, 5) of the lens (10) and of the semiconductor chip (4) disposed on the chip carrier (3) coincide at least approximately.