Transponder for lock mechanism in e.g. motor vehicle

摘要

The transponder has a semiconductor chip, a coil and a capacitor, with the transponder housing formed by a plastics mass. The capacitor is provided as a pair of metallised conductor layers applied to two opposing surfaces of the housing. Pref. the coil is incorporated in at least one of the capacitor conductor layers as a spiral or meandering conductor path. A metallic lead frame (4) acts as a mechanical carrier for the semiconductor chip, the coil and the capacitor, before embedding in the plastics housing. The frame also simultaneously provides the electrical connections between the chip, the coil and the capacitor on it's other side.