发明名称 |
PLANAR ELECTRONIC NETWORK |
摘要 |
A planar electronic network of passive electronic components on a chip are formed in a mass-producible method on a rigid substrate in a manner designed to maximize repeatability of the process. The wafer is diced into individual chips. The resulting chip is a network of single or multi-layer inductors along with resistors and capacitors, all of inherently sealed construction. The process utilized is a print-and-repeat style in which conductor paths are formed by successive plating operations to form a continuous circuit path.
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申请公布号 |
WO9712440(A1) |
申请公布日期 |
1997.04.03 |
申请号 |
WO1996US15441 |
申请日期 |
1996.09.25 |
申请人 |
ALLIEDSIGNAL INC. |
发明人 |
SWANSON, HAROLD, W.;GORDON, ALVIN, W.;MCHENRY, MICHAEL, R. |
分类号 |
H01F41/04;H03H3/00;H05K1/16;(IPC1-7):H03H3/00 |
主分类号 |
H01F41/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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