| 摘要 |
<p>The present invention provides a microelectronic assembly wherein a semi-crystalline copolymer adhesive composition (20), preferably provided in the form of a film, is used to electrically interconnect a first circuit pattern (14) on a first substrate (12) to a second circuit pattern (18) on a second substrate (16). The adhesive composition preferably includes a semi-crystalline copolymer comprising polyether and polyamide monomeric units, a tackifier, and conductive particles (22).</p> |
