发明名称 A thermal sink for a transducer assembly
摘要 <p>The cooling system comprises a housing (12) enclosing an ultrasound transducer assembly of a probe (2). A backing heat sink (20) of thermally conductive material has two surfaces, the first surface being positioned adjacent the ultrasound transducer assembly. The backing heat sink is rotatable. A fixed heat sink (22) of thermally conductive material, has two surfaces, the first surface being positioned proximate to the backing heat sink. A thermal coupling media (24), e.g. a thin oil layer, positioned between the backing heat sink and the fixed heat sink, is operative to promote heat transfer. A ball bearing preload screw (26) is operative to fasten the backing heat sink, the fixed heat sink, and the transducer element as an assembly such that the thermal coupling media is between the backing and fixed heat sinks. A first ball bearing (28A) is positioned proximate to the second surface of the backing heat sink and the first surface of the fixed heat sink. A second ball bearing (28B) is positioned proximate to the second surface of the fixed heat sink and the ball bearing preload screw.</p>
申请公布号 EP0766227(A2) 申请公布日期 1997.04.02
申请号 EP19960107992 申请日期 1996.05.20
申请人 HEWLETT-PACKARD COMPANY 发明人 PESZYNSKI, MICHAEL
分类号 A61B8/00;A61B8/12;F28F13/00;G10K11/00;(IPC1-7):G10K11/00 主分类号 A61B8/00
代理机构 代理人
主权项
地址