发明名称 Semiconductor integrated circuit devices having particular terminal geometry
摘要 A method of mounting semiconductor integrated circuit devices comprising steps of forming a semiconductor device block having a plurality of semiconductor integrated circuit devices of vertical mounting type coupled to each other in parallel, and mounting the semiconductor device block on a printed board. A block of semiconductor integrated circuit devices comprising a plurality of semiconductor integrated circuit devices of vertical mounting type, and coupling means for coupling the plurality of semiconductor integrated circuit devices each other in parallel.
申请公布号 US5616962(A) 申请公布日期 1997.04.01
申请号 US19940348128 申请日期 1994.11.28
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 ISHIKAWA, TOSHIMITSU;KITAMURA, ATSUSHI;HIRAYAMA, KENJI
分类号 H05K13/04;H01L23/31;H01L25/10;H01L25/11;H01L25/18;H05K1/18;H05K3/30;H05K3/34;(IPC1-7):H01L23/28;H01L23/50 主分类号 H05K13/04
代理机构 代理人
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