Semiconductor device

摘要

A semiconductor device has a plurality of chip regions each having semiconductor elements disposed therein and a plurality of electrode pads disposed on a surface thereof. The chip regions are separated and defined by scribing line regions. A plurality of dummy pads are disposed in the scribing line regions for use in positioning the electrode pads upon wafer probe test. The dummy pads are disposed in diagonally opposite positions across each of the chip regions one on each side of the each of the chip regions.