发明名称 |
Method for arranging conductive particles on electrodes of substrate |
摘要 |
A method for arranging conductive particles on electrodes of a substrate, which electrically connect with electrodes of an electric part via the conductive particles. An adhesive layer is formed on the electrodes. Conductive particles are arranged on the adhesive layer in a predetermined pattern. Then, the conductive particles on said electrodes of a substrate are affixed thereon.
|
申请公布号 |
US5616206(A) |
申请公布日期 |
1997.04.01 |
申请号 |
US19940260844 |
申请日期 |
1994.06.16 |
申请人 |
RICOH COMPANY, LTD. |
发明人 |
SAKATSU, TSUTOMU;YOSHIDA, YOSHIHIRO |
分类号 |
H01L21/48;H05K3/10;H05K3/32;(IPC1-7):B44C1/165 |
主分类号 |
H01L21/48 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|