发明名称 Power supply apparatus for package
摘要 A power supply apparatus for a package, in which power is supplied to a package connected to a shelf, aiming at supplying power to the package without using signal pins of a connecting part on a back wiring board and reducing voltage drop at a pattern on the back wiring board to a negligible degree. A fitting section of a package printed board and a fitting section are fitted to each end of a tab of the back wiring board, and a fitting section of a package printed board and a fitting section are fitted to each end of a tab of the back wiring board. Further, a connector on the package side of package printed board and a connector are fitted to each end of a signal terminal group of the back wiring board.
申请公布号 US5616034(A) 申请公布日期 1997.04.01
申请号 US19950493389 申请日期 1995.06.21
申请人 FUJITSU LIMITED 发明人 MASUDA, NATSUO;YAMAMOTO, HIROSHI;HORIZOE, HARUHIKO;HIRAMATSU, SHINJI;HIZUKA, HIDEHIKO;MATSUMOTO, MANABU;MOTOSEKO, TOSHIHIKO
分类号 H01R24/00;H01R12/16;H01R13/04;H01R13/115;H01R31/06;H05K7/14;(IPC1-7):H01R9/09 主分类号 H01R24/00
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