| 摘要 |
In a wafer polishing method and a device therefor, a surfactant solution is applied to the rear of a wafer by spraying or immersion before the wafer is attached to a holder. Even when the rear of the wafer is hydrophobic, it does not repel the solution and can be entirely covered therewith. Hence, it is possible to enhance the even polishing of the wafer while insuring the holding of the wafer. In addition, particles left on the wafer after polishing are easily removed in a cleaning step to follow. |
