HEAT-CURING EPOXY RESIN COMPOSITION

摘要

PROBLEM TO BE SOLVED: To obtain a heat-curing epoxy resin composition excellent both in storage stability and in low-temperature curability. SOLUTION: This resin composition comprises an epoxy resin and a curing agent which has covered surface active groups and is prepared by firmly fixing a fine powder of a median particle diameter of 2μm or below on the surface of a normally solid curing agent.