发明名称 CARRIER PLATE
摘要 PROBLEM TO BE SOLVED: To prevent warpage from being caused by making a strain difficult to be accumulated even though a carrier plate is repetitively used by a method wherein a groove is provided along an edge of the carrier plate. SOLUTION: In manufacture of a laminate for printed wiring board, the laminate is manufactured by heating and pressurizing a charge plate 6 on a carrier plate 1 in a molding press. Though a groove 8 is provided along an edge of the carrier plate 1 at that time, a working position of the groove 8 is outside a part wherein the charge product 6 is placed. The carrier plate 1 receives repetitively heating, pressurizing, and cooling, a strain is accumulated following increase of the number of times for use, which appears as warpage, and shear is generated in the charge product 6 in carring and in insertion into the molding press. Then, when the groove 8 is worked on a periphery of the carrier plate 1, the strain in receiving repetitively heating, pressurizing, and cooling is released by the groove 8, and the strain can be minimized. Since the warpage of the carrier plate is decreased thereby, the shear of the charge product 6 disappears. Then, a void of the laminate can be removed.
申请公布号 JPH0985764(A) 申请公布日期 1997.03.31
申请号 JP19950247129 申请日期 1995.09.26
申请人 HITACHI CHEM CO LTD 发明人 WATANABE TADAO;YOSHIE SHOICHIRO
分类号 B29C43/20;B29C43/32;B29K105/08;B29L9/00;B29L31/34;H05K3/00;H05K3/02;(IPC1-7):B29C43/32 主分类号 B29C43/20
代理机构 代理人
主权项
地址
您可能感兴趣的专利