发明名称 BINDING BAND FORMING METHOD AND BINDING BAND
摘要 <p>PROBLEM TO BE SOLVED: To reduce cost of a metal mold, to use the metal mold over a long period, and to reduce forming cost of a binding band, by forming the binding band by using the metal mold having a simple structure. SOLUTION: A binding band 21 is formed by making openings of an insertion hole 23a of a winding band binding part 23 and a hollow cylindrical part 24a of a stud bolt locking part 24 in the same direction as the mold opening direction of a metal mold.</p>
申请公布号 JPH0989165(A) 申请公布日期 1997.03.31
申请号 JP19950252086 申请日期 1995.09.29
申请人 SUMITOMO WIRING SYST LTD 发明人 SAKAKURA TAKAYUKI
分类号 F16L3/137;B29C45/26;(IPC1-7):F16L3/137 主分类号 F16L3/137
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