METAL FOIL-PLATED LAMINATED BOARD

摘要

PROBLEM TO BE SOLVED: To provide a metal foil plated laminated board which makes it possible to obtain a printed circuit board having small warpage in the case of forming the board by using the laminated board of the board continuously produced from impregnating to molding. SOLUTION: The metal foil-plated laminated board is obtained by laminating a plurality of base materials impregnated with resin varnish containing radical- polymerized thermosetting resin with thee base material to be continuously supplied, disposing a metal foil at least on one front surface layer of the laminate laminated with a plurality of the base materials, and then heating to cure it. The thickness of the resin layer between the base material and the foil and the thickness of the resin layer between the base materials are 1 to 10μm. The laminated board is obtained by impregnating the one base material to be continuously supplied with resin varnish containing radical-polymerized resin, disposing a metal foil at least on one front layer of the base material impregnated with the varnish, and then heating to cure it. The thickness of the resin layer between the base material and the foil is 1 to 10μm.