发明名称 MANUFACTURE OF THIN FILM SEMICONDUCTOR DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To conduct an efficient crystallization of a semiconductor thin film, which is used as the active layer of a thin film transistor which is formed by lamination in a thin film semiconductor device. SOLUTION: In order to manufacture a thin film semiconductor device, a film- forming process is first performed and an amorphous semiconductor thim film 2 is formed on the surface of an insulating substrate 1, which extends in the longitudinal direction (a direction X) and the width direction, which intersect orthogonally each other. Then, an annealing process is performed and energy is applied from the outside to convert the thin film 2 from the amorphous thin film into a polycrystalline thin film. After this, a thin film transistor is formed by laminating using the thin film 2 as its active layer. In the annealing process, comparatively low-energy ultraviolet rays 23 formed linearly along the width direction of the substrate 1 are emitted to the substrate 1 from the rear side of the substrate 1, while a comparatively high-energy laser beam 4 shaped linearly along the width direction of the substrate 1 similarly is emitted to the substrate 1 from the surface side of the substrate 1 in such a way that the beam 4 is rougly aligned with the irradiated region of the rays 23. At this time, the substrate 1 is moved in the direction X relatively to the irradiated region.</p>
申请公布号 JPH0982662(A) 申请公布日期 1997.03.28
申请号 JP19950264999 申请日期 1995.09.19
申请人 SONY CORP 发明人 NOGUCHI TAKASHI
分类号 G02F1/136;G02F1/1368;H01L21/02;H01L21/20;H01L21/26;H01L21/268;H01L21/336;H01L27/12;H01L29/786;H01S3/00;(IPC1-7):H01L21/268 主分类号 G02F1/136
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