CERAMIC MULTI-LAYERED SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To eliminate nickel plating by forming a surface conductor on a ceramic multi-layered substrate by printing paste comprising a nickel material on the surface of the ceramic multi-layered substrate after calcination and then calcining the same. SOLUTION: After a non-calcined ceramic green sheet where an internal layer conductor 4 is printed and a via conductor 5 is applied is laminated, the sheet is subjected to binder-removal in an oxidation atmosphere. Then, CuO is reduced to Cu in a reducing atmosphere containing hydrogen, and then the sheet is calcined in a nitrogen atmosphere in a belt type calcination furnace to obtain a Cu ceramic multi-layered substrate 1. Ni paste is screen printed on an outermost layer and is calcined in a nitrogen atmosphere in the belt type calcination furnace to form a surface conductor 2. The surface of the surface conductor 2 is subjected to Au plating 3 for improving solder wetting properties.