| 摘要 |
<p>PROBLEM TO BE SOLVED: To make it possible to set the temperature of a wafer over a wide range of a high temperature at which the wafer is easily deformable to a low temperature in a wafer temperature controller and to make the temperature in the wafer surface uniform. SOLUTION: A current is suppled to a wafer 10 via a support member 1 to generate Joule heat to control to uniformly heat the surface of the wafer 10. The member 1 is lowered to bring the wafer 10 into direct contact with a stage 3 to be able to quickly cool it. Thus, the temperature of the wafer 10 can be controlled from the high temperature to the low temperature.</p> |
