| 摘要 |
<p>PROBLEM TO BE SOLVED: To realize a cooling structure of a semiconductor device or especially a multi-chip module comparatively small in heat release value, wherein the device can be lessened in weight as a whole, and impurities are restrained from penetrating into the device. SOLUTION: A resin package 2 is so molded as to seal up the board 3 with resin in such a manner that the one end faces of heat conductive nuts 22 (or screws 25) are bonded to the required spots of a board 3 mounted with chip parts 4-1 and 4-2 which form a circuit device, and the other end faces of the nuts 22 (or parts of screws 25) are exposed to the outside, and a heat dissipating fin 24 is mounted on the nuts (or screws) with screws (or nuts) which fit in the nuts (or screws).</p> |
