| 摘要 |
PROBLEM TO BE SOLVED: To efficiently remove the resist pattern coated on the surface of a wafer, and to improve the operating efficiency of the removing device. SOLUTION: The titled resist removing device is composed of a taping mechanism 4 with which an ultraviolet-hardening type precut tape is attached to the surface of a wafer when a resist pattern is deposited, a heating mechanism 5 with which a plurality of taped wafers are housed and heat treatment is conducted simultaneously, an ultraviolet radiating mechanism 6, with which ultraviolet rays are emitted to the adhesive tape on the heated wafers, a tape removing mechanism 7, with which the precut tape on the surface of the wafers is removed, and a conveying mechanism, with which the wafers are successively conveyed to each mechanism, are provided. |
