发明名称 |
A METHOD FOR MANUFACTURING FOR THERMAL SENSOR USING SEMICONDUCTOR DIODE |
摘要 |
The present invention provides a method of making a temperature sensor using a semiconductor diode that can measure a temperature on the basis of the fact that leakage current measured during reverse bias voltage application is dependent on the temperature. This method includes the steps of forming an n- or p-type impurity highly doped well (2) on a silicon substrate (1); forming an isolation oxide film (3) by applying isolation process to a region except the well (2)'s certain region; forming a semiconductor diode by forming an opposite-type impurity lightly doped diffusion layer (4); etching the oxide film (3)'s given portion to expose the well (2) to make the well (2) contact well-pickup metal line to form a well pickup region (5); forming a metal layer (6) on the region (5), the oxide film (3) and the diffusion layer (4); and etching the metal layer (6)'s given portion to isolate a first metal line (6a) on the well pickup region (5) from a second metal line (6a), thus forming a temperature sensor.
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申请公布号 |
KR970004497(B1) |
申请公布日期 |
1997.03.28 |
申请号 |
KR19930017449 |
申请日期 |
1993.09.02 |
申请人 |
HYUNDAI ELECTRONICS IND.CO.,LTD. |
发明人 |
HWANG, SUNG-BO;LEE, KEUN-YUK |
分类号 |
H01L35/22;(IPC1-7):H01L35/22 |
主分类号 |
H01L35/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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