METHOD AND DEVICE FOR MANUFACTURING CIRCUIT SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To obtain a high-quality circuit substrate by continuously applying a mold-release film to the front and rear surfaces of a prepreg sheet with a superb quality. SOLUTION: When a film cutter 8 is mounted while only a mold-release film 2 of film supply parts 3a and 3b which are arranged up and down in advance is passed through heating rolls 4a and 4b and cooling rolls 5a and 5b by bringing the application surface of a mold-release agent into contact and is properly squeezed out, an arbitrary number of slits enter the mold-release film 2 and are sent to the heating rolls 4a and 4b. Then, when a prepreg sheet 1 is introduced from an introduction port 6 to the rotary part of the heating rolls 4a and 4b, it passes through the heating rolls 4a and 4b and the cooling rolls 5a and 5b, the mold-release film 2 which is divided into an arbitrary number of portions by the resin constituent of the prepreg sheet 1 which is melted due to heating and pressing is adhered and then discharged to a take-out part 7.