| 摘要 |
PROBLEM TO BE SOLVED: To prevent any void from being produced, extend the freedom of laminate conditions, and smooth also the surface of an insulating substrate after lamination and integration by forming a plated resist on the insulating substrate, and providing on an internal layer the substrate in which a required conductor circuit pattern is formed by a method including an electrodeless plating in a gap between the insulating substrate and the plated resist and a circuit surface is flat. SOLUTION: A copper foil is overlapped such that an uneven surface of the copper foil makes contact with a prepleg, and it is pressed, heated, and united. Then, the copper foil is etched and removed. Further, paradium as a plating catalyst is dipped in a processing solution as a preprocessing of electrodeless plating whereby the plating catalyst is applied on a substrate surface. Then, a plating resit is formed. The resist is dipped in an electrodeless copper plating solution, and plated copper is separated, and thereafter it is heated to prepare an internal layer substrate. A bonding agent film layer is provided on a roughened surface of a printed wiring board copper foil, and is cured onto a B stage. Further, the internal layer is overlapped such that it makes contact with the bonding agent layer side of the substrate in which a hole is formed, and is pressurized and heated for lamination and integration. |
