| 摘要 |
PROBLEM TO BE SOLVED: To obtain a semiconductor device that wiring and element characteristics on a semiconductor chip are not impaired while obtaining the reliability of the chip by providing an air gap having a through hole, a recess or a protrusion on a circuit substrate surface region and not injected and formed with sealing resin on the wiring and elements. SOLUTION: The semiconductor device comprises a circuit substrate 6, a semiconductor chip 3 having wiring 1 and elements 2 flip-chip mounted on the substrate 6 and formed on the surface of the substrate 6, and sealing resin 4 injected and formed between the substrate 6 and the chip 3. In such a semiconductor device, air gaps 8, 9 not injected and formed with the resin 4 are formed on the wiring 1 and elements 2 having a through hole 11, a recess 10 or a protrusion on the surface region of the substrate 6 opposed to at least the wiring 1 and the element 2. The recess 10 is provided by forming an insulating film made of a dry film so patterned as to remove the recess 10 such as, for example, the part of the recess 10 on the substrate 6.
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