| 摘要 |
PROBLEM TO BE SOLVED: To improve the accuracy of a cut size by holding a layer on a frame, and hydrostatically pressing it for contact bonding, and thereafter cutting the layer in the state where it is held on the frame. SOLUTION: A layer 1 is put in a frame 2. The layer 1 is held between a base plate 3 and an upper plate 4, and the entire is surrounded with a flexible sheet, vacuum wrapped, and rendered to contact bonding with hydrostatic press. After the contact bonding, the flexible sheet, the base plate 3, and the upper plate 4 are removed, and in the state where the layer 1 is held on the frame 2 the layer 1 is cut with a cutting blade 6 using a cut mark 5 printed on the layer 1 as a reference into each chip parts. Each chip parts are calcined, and thereafter an external terminal electrode is formed with printing and plating to manufacture layered chip parts. Upon the layer 1 being cut the layer 1 is cut keeping the state where it is held on the frame 2 without being demounted from the frame 2 used upon the contact bonding, so that variations of the outer size of the layer can be reduced to improve cut accuracy. |
