| 摘要 |
PROBLEM TO BE SOLVED: To detect the accurate amount of superpositional deviation of the outermost circumference of the substrate to be treated by a method wherein error data is computed by adding the second linear error component and the corresponding second random error component. SOLUTION: The superpositional deviation of the unit pattern of a nine-shot, which is not positioned on the outermost circumference designated on the surface of a wafer, is measured (Step 1). The six error parameters are led out based on the amount of deviation obtained by the above-mentioned measurement (Step 2). The first random error component is computed using the led out six error parameters as the linear error component of the measurement data (Step 3). Besides, the second linear error component of the outermost circumferential shot is led out (Step 4), the second random error component, corresponding to the above-mentioned second linear error component, is computed based on the first random error component, the second linear error component and the corresponding second random error component are added, and error data is computed. |
