| 摘要 |
PROBLEM TO BE SOLVED: To perform stable wire bonding, which performs first bonding by bonding the edge of the wire to the primary side electrode and then performs second bonding by extracting the wire to a secondary side electrode, even for a highly integrated device. SOLUTION: First bonding is performed by bonding the edge of the wire 14 to an electrode pad 18 formed on a semiconductor chip 12, and second bonding is performed by extracting the wire 14 to a bonding lead 13. Before bonding the wire 14 to the bonding lead 13, a metal bump 10 is formed on the bonding lead 13 and trimming is performed by applying pressure to the metal bump 10. |
