| 摘要 |
<p>PROBLEM TO BE SOLVED: To protect a chip against damage by a method wherein the joint of at least either a lead frame or a pad frame is made to serve as an island-like pad supported by at least a support member which extends from a joint frame that surrounds the joint. SOLUTION: Two frames, one is a lead frame 1 of Fe-Ni alloy and the other is a die pad frame 10 of Fe-Ni, are used. Joints 1b and 10b of one of the two frames are made to serve as island-like pads supported by support, members which extend from joint frames 1c and 10c that surround the joints 1b and 10b. The support members of the joints 11c and 10b are formed like an S shape or a Z shape. By this setup, a semiconductor device can be protected against assembly failures caused by the deformation of a frame and dust scattered over a semiconductor chip and ramified to a die pad and enhanced in manufacturing yield.</p> |
