发明名称 WAFER CASE
摘要 <p>PROBLEM TO BE SOLVED: To provide a wafer case which makes it possible to safely package and transport a plurality of wafers by making it possible to safely and efficiently operate the wafer. SOLUTION: The wafer case has a wafer containing unit 2 and a cutout groove 3 on the surface 4 of the case 1, and a ring-like protrusion and a rotation preventive protrusion 8a on the rear surface 5 of the case 1. The protrusion is inserted into the unit 2, the protrusion 8a is inserted into the groove 3 to stack the cases 1. Then, the outer peripheral edge of the wafer contained in the unit 2 becomes the state that the edge of the wafer contained in the unit 2 has a slight gap by the protrusion, the wafer does not rattle in the unit 2 and the case 1 is not rotated. Thus, the wafer can be operated safely and efficiently, and there is no fear of damaging the wafer contained in the unit or sticking dusts to the wafer surface.</p>
申请公布号 JPH0982789(A) 申请公布日期 1997.03.28
申请号 JP19950235589 申请日期 1995.09.13
申请人 SONY CORP 发明人 MAKITA TOSHIYUKI;UGAWA KAZUHISA
分类号 B65D85/86;H01L21/673;H01L21/68;(IPC1-7):H01L21/68 主分类号 B65D85/86
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