| 摘要 |
PROBLEM TO BE SOLVED: To enable respective electrodes of semiconductor element to be connected to a specific outer electric circuit for a long term by a method wherein outerconnecting pads are firmly connected to the wiring conductor of an outer electric circuit substrate by concentrically forming the outer connecting pads in the narrow region beneath an insulating base substance. SOLUTION: Outer connecting pads 3 are formed beneath the insulating base substance 1 of the title semiconductor element mounting wiring substrate to be packaged on an outer electric circuit substrate 1. At this time, a plurality of outer connecting pads 3 are concentrically formed so that the area in the region encircled by the connecting pads 3 on the lowermost part may not exceed 50% of the whole area beneath the insulating base substance 1. Accordingly, even if any thermal stress due to the difference in the thermal expansion coefficients between the insulating base substance 1 and the outer electric circuit substrate is imposed, the thermal stress will not be notably imposed on the connecting part between the outer connecting pads 3 and the wiring conductor of the outer electric circuit substrate thereby enabling the outer connecting pads 3 to be firmly junctioned with the wiring conductor of outer electric circuit substrate. |
