METHOD OF MOLDING PACKAGE MOLD PART IN ELECTRONIC COMPONENT AND DEVICE

摘要

PROBLEM TO BE SOLVED: To reduce the cost for molding by preventing the loss of resin when molding the package mold parts for sealing semiconductor chips to lead frames. SOLUTION: Material resin is melted by heating inside each material resin filling chamber 4 arranged with an opening directed to the molding cavity 2a of package mold part of the metal mold 2a of either of metal molds 1 or 2 that press a lead frame between them and fills inside the molding cavity of the package mold part by pushing movement of a plunger 5 to the inside of the material resin filling chamber 4.