| 摘要 |
PROBLEM TO BE SOLVED: To make it possible to produce wafers having good quality at a good yield by making it possible to judge whether the wafers are good or not in a wafer process or wafer working process without evaluating head characteristics. SOLUTION: Theρ-H measuring patterns B of the non-shield simulating the reading out parts of MR head product patterns A and theρ-H measuring patterns C near the shields simulating the laminated structure of reading-out parts and writing parts are dispersed and arranged to coexist to coexist in the many MR head product patterns in the wafer. At this time, the width of the MR elements 56 of bothρ-H measuring patterns is made coincident with the MR element width of the final products. In addition, bothρ-H measuring patterns are arranged to deviate so that the MR elements 56 exist on the more back side (direction deeper than the floating surface) than a target (x-x) for working a gap depth, these by, the elements are so formed as not to be subjected to gap depth working at a post stage.
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