| 摘要 |
<p>A semiconductor device whose packing density is high and which has a lot of functions. This device is manufactured by joining semiconductor elements to each other by solid phase welding through metallic thin films. Since the semiconductor elements, which have conventionally been joined to each other with an adhesive or solder, are joined by the method of the invention, the strength, heat radiating property, and dimensional accuracy of the joint are improved and the length of wiring is shortened or the wiring itself can be omitted. Semiconductor elements are stacked by using this joining method, and hence a high-density semiconductor device which performs arithmetic operation at a high speed and has a high reliability is manufactured.</p> |
