摘要 |
The invention relates to electrical and electronic components made of a polyamide composition and possessing an improved resistance under soldering conditions, particularly when the surface mounting technique is used. This is achieved by using a polyamide composition whose main chain essentially consists of units derived from aliphatic dicarboxylic acids and diamines or alpha , omega -amino acids, and in which 1-40 % of the chain units are derived from 1,6-cyclohexanedicarboxylic acid and an aliphatic diamine, or from 1,4-cyclohexanediamine and an aliphatic dicarboxylic acid. As a result, the temperature at which blisters are formed during soldering by the infrared method is 20-30 DEG C higher than in the case of the homo-polyamide.
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申请人 |
DSM N.V.;KONING, CORNELIS, EME;KNAPE, PETRONELLA, MARIA;LEEUWENDAL, ROBERT, MAARTEN;ORTMANS-SCHIFFER, JOSEFINA, MARIA, ANNA |
发明人 |
KONING, CORNELIS, EME;KNAPE, PETRONELLA, MARIA;LEEUWENDAL, ROBERT, MAARTEN;ORTMANS-SCHIFFER, JOSEFINA, MARIA, ANNA |