| 摘要 |
A flipchip LSI is mounted on a glass substrate through the use of bonding techniques. An insulating layer made of, for example, epoxy resin is formed between the LSI chip and the glass substrate in such a manner that the insulating layer is fixed to both of the LSI chip and the glass substrate. The insulating layer functions to absorb strain caused by differences of the coefficient of thermal expansion of the LSI chip and the glass substrate, thereby securing stable operation of the LSI chip. |
