Schaltungsplatine sowie Verfahren zum Herstellen einer Schaltungsplatine

摘要

The board has a multilayer structure with an underlying carrier board (12) of glass-fibre-reinforced epoxy resin and two superimposed high-current boards (14,16) separated by insulating adhesive film (26). Conductive tracks (20) on both sides of the carrier interconnect low-current electronic components (24) on its underside. Holes are drilled through the boards for pluggable contacts (38) with the carrier. The conductive track structure (28) on the high-current boards themselves is provided preferably by stamping out of sheet metal or foil.