Verfahren zum Herstellen eines Steckverbinders für eine IC-Karte

摘要

A method for fabricating a receptacle connector (12) for use in an IC card assembly wherein the receptacle connector is adapted for mounting generally at an edge (23) of a circuit substrate (6). A housing (50) is provided with an upper surface (74) and a plurality of terminal-receiving passages (52) in a dual row configuration extend parallel to the upper surface. The circuit substrate is adapted to be located a given vertical distance from the upper surface of the housing. A plurality of receptacle terminals (18) are inserted into the passages with surface mount tail portions (54) of the terminals projecting outside the passages. The vertical distance between the circuit substrate and the top of the housing is determined. The tail portions of the two rows of terminals initially project in a generally straight planar array from a rear face of the housing. In a single final forming step, the surface mount tail portions are formed into coplanar curved contact portions (56) such that the contact portions of the surface mount tail portions will engage a corresponding single row contact pad array (20) on the edge of the circuit substrate when the receptacle connector is mounted generally thereon.