发明名称 Process for producing a device using a thin layer film structure
摘要 The invention relates to a process for manufacturing devices incorporating a thin layer film structure, which process makes it possible in particular to not pass on to a first part of the device the effects of certain operations required in manufacturing the second part formed by the thin layer film structure. …<??>To this end, the process of the invention consists in using an intermediate support (13) in order to produce an intermediate assembly (12) comprising the thin layer film structure (11), in then transferring the intermediate assembly (12) onto the first part (10), and in then at least partially removing the intermediate substrate (13). …<IMAGE>…
申请公布号 HK34197(A) 申请公布日期 1997.03.27
申请号 HK19970000341 申请日期 1997.03.20
申请人 THOMSON-CSF PASSIVE COMPONENTS - TPC 发明人 JEAN-MARC COUTELLIER;ALAIN JACOBELLI;FRANCOIS MAURICE;PAUL-LOUIS MEUNIER
分类号 G11B5/127;G11B5/187;G11B5/23;G11B5/31;H01L21/302;(IPC1-7):G11B5/31 主分类号 G11B5/127
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