| 摘要 |
The micropackage includes a semiconductor chip (11) disposed on a first face of an insulating support (12), and electrical contact zones extending along a plane defined by a second face of said insulating support (12), the semiconductor chip (11) being connected to the electrical contact zones (13) via connection wires (14). The micropackage (10) includes: ```a metal strip provided with cut-outs defining the electrical contact zones (13); ```a strip of insulating material disposed on one face of the metal strip, the strip of insulating material constituting the insulating support (12), and sparing, the electrical contact zones (13); ```a housing (130) for the semiconductor chip (11), surrounding the insulating support (12) and obstructing those cut-outs in the metal strip which are inside the housing (130) and which are not obstructed by the insulating support (12); and ```a coating of resin covering the semiconductor chip (11) and the connection wires (14), at least partially filling the housing (130). Applications include electronic memory cards having microprocessors, and in particular microprocessors constituted by large-sized semiconductor chips. |
